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ANALYSIS OF INTERCONNECT PERFORMANCE USING FDTD TECHNIQUE

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dc.contributor.author Mittal, Shailesh
dc.date.accessioned 2014-10-05T09:45:40Z
dc.date.available 2014-10-05T09:45:40Z
dc.date.issued 2012
dc.identifier M.Tech en_US
dc.identifier.uri http://hdl.handle.net/123456789/4051
dc.guide Yadav, K. L.
dc.guide Kaushik, B. K.
dc.description.abstract Device scaling in deep Submicron technology shrinkage the spacing between adjacent interconnect, which leads to increase coupling effect between wires. Continuous device scaling much improved the gates delay. However, interconnect delays have not scaled in that proportion Therefore a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects becomes necessary. This thesis presents the description of a finite difference time domain (FDTD) method that is intended for estimation of voltages and currents on transmission line. Interconnect performance such as crosstalk, delay, crosstalk induce delay are analyzed using FDTD technique. For motivation, analytical results based on proposed model is also compared with HSPICE simulated result. Analytical results are observed in closed agreement with HSPICE results, which proves the validity of proposed model. en_US
dc.language.iso en en_US
dc.subject PHYSICS en_US
dc.subject FDTD TECHNIQUE en_US
dc.subject HSPICE en_US
dc.subject INTERCONNECT PERFORMANCE en_US
dc.title ANALYSIS OF INTERCONNECT PERFORMANCE USING FDTD TECHNIQUE en_US
dc.type M.Tech Dessertation en_US
dc.accession.number G21893 en_US


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