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3®DIMENSIONAL SIMULATION OF SINGLE EVENT UPSET OF 6T-SOI BASED 24 nm —FINFET -SRAM CELL

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dc.contributor.author Jayaram, Namani
dc.date.accessioned 2014-09-27T06:45:27Z
dc.date.available 2014-09-27T06:45:27Z
dc.date.issued 2013
dc.identifier M.Tech en_US
dc.identifier.uri http://hdl.handle.net/123456789/2340
dc.guide Dasgupta, Sudeb
dc.guide Bulusu, Anand
dc.description.abstract Recent years the radiation effects on modern electronic devices are considered to be an important task, due to continues technology scaling and minimal nodal capacitances. Heavy ion impacts on electronic devices causes the large amount of electron-hole pair generation along it's track. The generated charge under the established electric fields would create the electrical disruptions and changes in node voltages. This became worse for the current technologies due to reduced feature sizes and supply voltages. In this report, we present radiation particle interactions, effects on FinFET SRAM cell. The main objective of this report is to benchmark the FinFET to get the required performance followed by 3-dimensional numerical simulation of 6T-SRAM cell as a contiguous block of silicon and to study the impact of heavy ions on the data states of the cell. We studied the critical charge (Q,.1-i,) characterization of the designed SRAM cell and found the SEU threshold Linear Energy Transfer (LET). en_US
dc.language.iso en en_US
dc.subject SRAM en_US
dc.subject MEMORY en_US
dc.subject FINFET en_US
dc.subject ELECTRONICS AND COMPUTER ENGINEERING en_US
dc.title 3®DIMENSIONAL SIMULATION OF SINGLE EVENT UPSET OF 6T-SOI BASED 24 nm —FINFET -SRAM CELL en_US
dc.type M.Tech Dessertation en_US
dc.accession.number G22261 en_US


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