ANALYSIS OF A THIN FILM UNIFORM DISTRIBUTED RC STRUCTURE IN VARIOUS CONFIGURATIONS WITH A - LUMPED ELEMENT

Abstract

The present trend in manufacturing electronic circuits and instruments is towards achieving smaller and smaller physical sizes; lighter weight higher reliability and cheaper in costa RC lines of various geometri€es have been analyzed mathematically to meet the, above mentioned requirements to serve as low pass; Band pass; Highpass; phase lead; phase shift and coupling networks etc. As the mathematical expressions are quite comp-licated; the utility and significance of the lines are difficult to ascertain. A comprehensive numerical analysis of the transfer functions of a distributed RC structure in various terminal configuration with a lumped component resistance or capacitance in parallel to the output terminals of the distributed structure has been developed and reported in this dissertation. The well known characteristic functions have been used here as the basic quantities to characterise the various distributed RC— Lumped circuits. Utilising the results the magnitude and phase angles of the voltage transfer functions of the various configurations have been evaluated with the help of the digital computer TDC-312. The results are intended to show certain noval characteristics of the integrated (iv) microsystems unobtainable from the conventional lumped components counterparts. The computed results have been plotted against normalized frequencies for different values of N to study the behaviour of the structurd. The careful examination of the plotted curves reveals that circuit Fig.3.2 a,b,c, and d, behave* like Attenuator; Quadrature phase. shift; Lead network and High pass respectively.