INVESTIGATION OF NATURAL COOLING OF ELECTRONIC COMPONENTS IN VERTICAL CHANNEL

Abstract

Extreme miniturisation of electronic devices has reintroduced thermal problem. The failure of electronic components increases exponentially as the junction. temperature.-increases. It is important in the designing of these electronic components to predict the heat transfer characteristics for all anticipated modes of heat transfer. Natural convection is an important mode of heat transfer for both air and liquid cooling. In many electronic cooling situations, array •of heat dissipating components are mounted on flat parallel plates forming .a series of passage, each having either one very rough wall and other relatively smooth or both walls rough. A number of investigators has investigated different situations of cooling of these arrays using air circulated by naturally generated buoyant force. In the present work the channels having heat dissipating components mounted on partition wall midway the channel have been investigated. For analysis purpose three different widths of the channels have been analysed and results are presented in the form of tables and correlations for natural connective heat transfer.