PERFORMANCE ANALYSIS OF CARBON NANOTUBE BASED INTERCONNECT

Abstract

In the era of nano-technology, Carbon Nanotube (CNT) is considered as an emerging material for the purpose of interconnects. It is because of their extremely good electrical, mechanical and thermal properties as compared to copper and other interconnects. When two or more parallel interconnect lines are used for transmission purpose, a disturbance in the propagation of a signal is observed, and this disturbance is called crosstalk delay. It has a negative impact on the signal transmission. At local level, CNT produces a larger crosstalk delay whereas at intermediate and global levels, CNT interconnects can achieve smaller signal delay than that of Cu or other interconnects, and the improvements become more significant with technology scaling and increasing wire lengths. In 2013, the ITRS predicts a higher value of current density of 3.3x106 A/cm2. As per current technology this higher values can only be supported by CNTs, as theoretical and experimental reports shows the value of current densities for CNTs is upto 109 A/cm2. So, for future high-speed VLSI interconnect technology, CNTs may be proved as most outstanding organic material.