MODELING OF SUB-INTERFACE CRACK IN PIEZOELECTRIC BI-MATERIAL USING XIGA

Abstract

Due toqtheir strongqpiezoelectric,wdielectric, andapyroelectric properties,qpiezoelectric ceramics have.become popular.materials.for a wide range of electrical and mechatronicq systems. Piezoelectric ceramics, on the other hand, are brittle and crackable at all scales, from electric domains to devices. In piezoelectric ceramics, imperfections such asqdomain walls,qgrain.boundaries, faultsqand pores,qimpurities andqinclusions, and so on exist. The imperfections generateqgeometric,qelectric, thermal, andqmechanical discontinuities, resultingqin high stressqand electricqfield concentrations, which can lead toqcrack initiation, crackqpropagation, partialqdischarge, andadielectric breakdown,qfracture, andqfailure. Because the reliability of theseadevices is so important, there has been a lot of interest in understanding theqfracture andqfailure characteristics of these materials. This article provides an overview of the fracture behaviour of piezoelectric materials using theoretical, experimental, and numerical methodologies. It evaluates piezoelectric materials' fracture behaviour in a combined mechanical and electrical loading (electro-mechanical) environment. It also includes the present stage of computational progress for piezoelectric modelling that has been achieved. The dissertation discusses the fundamentals of the freshly invented XIGA approach. The extended finite element technique (XFEM) and isogeometric analysis are combined in XIGA, a numerical method (IGA). The XIGA technique has proven to be superior to other recent methods because it creates a close link between computer-aided design (CAD), geometry, meshing, and analysis.