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dc.contributor.authorSingh, Kartikey-
dc.date.accessioned2026-01-29T11:46:44Z-
dc.date.available2026-01-29T11:46:44Z-
dc.date.issued2016-05-
dc.identifier.urihttp://localhost:8081/jspui/handle/123456789/18753-
dc.description.abstractPrinting is one of the most essential components of packaging material. It is often necessary to modify the surface for printing some time it require a special surface. Despite all these efforts some surfaces are difficult to print. It had been a serious problem for years to print such surfaces. Advent of transfer printing reduced this problem and today most of the surfaces are readily printable. However, printing is often done on a separate sheet or surface and attached to the molded packaging or container. This increases the cost of material and operation. Further there is a need of a totally printing section to take care of it. It is a lacuna that needed to be addressed. Present work is a step to overcome the lacunae .Transfer printing with thermal energy is a technology that has progressed towards it. Transfer printing is a technology of transferring the print from one surface to another by exciting the transfer process which otherwise remains inactive. One of process of activation is thermal. Heat and pressure are applied on the surface to be transferred and the print gets transferred from a pre printed surface. This project aims to utilize this process of thermal printing and transfer of print from one of the substrate to another. The film is casted on a supported film and the support gets detached during transfer. The whole set of operation that needed in present case is a print supporting surface, an adhesive layer and a print layer The technology of print layer is well documented and practiced, supportive layer is also known as it tattoo only a reactive adhesive layer to be activated during contact with required substrate needed to be designed The objective of present work is to develop the adhesive layeren_US
dc.description.sponsorshipINDIAN INSTITUTE OF TECHNOLOGY ROORKEEen_US
dc.language.isoenen_US
dc.publisherIIT ROORKEEen_US
dc.subjectPrintingen_US
dc.subjectPackaging Materialen_US
dc.subjectMolded Packagingen_US
dc.subjectLacunae Transfer printingen_US
dc.title"TO DEVELOP A HIGH SPEED PRINT SYSTEM FOR TRANSFER PRINTING FOR A INCOMPATIBLE PACKAGING MATERIAL SURFACEen_US
dc.typeOtheren_US
Appears in Collections:MASTERS' THESES (Paper Tech)

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