STUDIES ON ADHESIVE JOINING OF COPPER USING NANO-COMPOSITE ADHESIVE

Abstract

Effect of well dispersed nano particles filled epoxy based adhesive prepared by innovative ultrasonic dual mixing on lap joint of copper was investigated. The composite adhesive containing 1, 3, and 5 vol. % of about 30±5 rim size hO2 used to prepared adhesive joints. The lap shear joint of the composite adhesive are characterized by their Lap shear strength as a function of bond line thickness as well as amount of filler. Nano particles filled epoxy adhesive joints was compared with neat epoxy joints in respect to its bond strength and durability. The bond line thickness of the adhesive with respect to amount of nano TiO2 filler has been optimized for maximum tensile lap shear strength of mechanically and chemically treated copper substrate. Copper have tendency to form brittle amine compound when amine hardener is used as a curing agent. To avoid that, a barrier layer is over the copper surface by using different types of chemical treatment. Chemically treated copper joint with composite adhesive shows higher lap shear strength as compare to mechanically treat copper joint with neat epoxy. FeCl3 type of chemical treatment shows better result as compare to other types of chemical treatment with respect to lap shear strength of joint.