ELECTRODEPOSITION OF POROUS COPPER SUBSTRATE AND NICKEL ELECTROCATALYST FOR HYDROGEN EVOLUTION REACTION

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DC Field	Value	Language
dc.contributor.author	Modi, Vishal	-
dc.date.accessioned	2025-06-30T14:30:22Z	-
dc.date.available	2025-06-30T14:30:22Z	-
dc.date.issued	2013-06	-
dc.identifier.uri	http://localhost:8081/jspui/handle/123456789/17413	-
dc.description.abstract	Porous nickel structure was observed by a double coating electro deposition process. Firstly porous copper layer was observed when electrodeposition on copper substrate was occurred in "0.05 MCuSO4 ,0.50 M H2SO4" solution. After porous copper deposition nickel was deposited on porous copper substrate in "1.26 M NiSO4,0.I0 M NiCl2,0.60 1-131303" solution. Electrodeposition were done by direct current method at different temperature, kept other parameters constant like pH and current density. Electrodeposition was characterized by scanning electron microscopy (SEM).	en_US
dc.description.sponsorship	INDIAN INSTITUTE OF TECHNOLOGY ROORKEE	en_US
dc.language.iso	en	en_US
dc.publisher	I I T ROORKEE	en_US
dc.subject	Electrodeposition	en_US
dc.subject	Direct Current	en_US
dc.subject	Porous Copper	en_US
dc.subject	Nickel	en_US
dc.title	ELECTRODEPOSITION OF POROUS COPPER SUBSTRATE AND NICKEL ELECTROCATALYST FOR HYDROGEN EVOLUTION REACTION	en_US
dc.type	Other	en_US
Appears in Collections:	MASTERS' THESES (MMD)

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