ELECTRODEPOSITION OF POROUS COPPER SUBSTRATE AND NICKEL ELECTROCATALYST FOR HYDROGEN EVOLUTION REACTION

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Title:	ELECTRODEPOSITION OF POROUS COPPER SUBSTRATE AND NICKEL ELECTROCATALYST FOR HYDROGEN EVOLUTION REACTION
Authors:	Modi, Vishal
Keywords:	Electrodeposition;Direct Current;Porous Copper;Nickel
Issue Date:	Jun-2013
Publisher:	I I T ROORKEE
Abstract:	Porous nickel structure was observed by a double coating electro deposition process. Firstly porous copper layer was observed when electrodeposition on copper substrate was occurred in "0.05 MCuSO4 ,0.50 M H2SO4" solution. After porous copper deposition nickel was deposited on porous copper substrate in "1.26 M NiSO4,0.I0 M NiCl2,0.60 1-131303" solution. Electrodeposition were done by direct current method at different temperature, kept other parameters constant like pH and current density. Electrodeposition was characterized by scanning electron microscopy (SEM).
URI:	http://localhost:8081/jspui/handle/123456789/17413
metadata.dc.type:	Other
Appears in Collections:	MASTERS' THESES (MMD)

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