Please use this identifier to cite or link to this item:
http://localhost:8081/jspui/handle/123456789/17070
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Singh, Dolly | - |
dc.date.accessioned | 2025-06-24T15:36:28Z | - |
dc.date.available | 2025-06-24T15:36:28Z | - |
dc.date.issued | 2014-06 | - |
dc.identifier.uri | http://localhost:8081/jspui/handle/123456789/17070 | - |
dc.description.abstract | The thermal contact conductance between metallic surfices has recently become of' considerable interest in a number of fields, in the present work, an experimental method has been used for estimating the TCC between two metallic surfaces (Al and Mild Steel), which are in continuous contact and the geometry of contact is flat. Since 1'CC.' is a complex phenomenon and difficult to predict so in experiment certain assumption are also considered during estimation of'l'CC Iike heat conduction is one dimensional axial to the specimen and flow is transient in nature.. l'he most prominent of its applications include space vehicles, space-vehicle-energy conversion devices, electronic packaging, nuclear reactor and manufacturing processes like metal cutting, casting. This report presents a experimental for study of the interface thermal-contact conductance between metals with different roughness and interstitial pressure (at No-loading. 4MPa, 8MPa. I2MPa. and I6MPa) under steady- state approach. A proposed approach to thermal conductance concludes the narrative portion of this report. The experiments will be performed on aluminium and mild steel for a range of contact pressures (0-I6MPa) and interface temperature in between 5(T-15 C.) Since. !I'om the literatures, it is evident that the limited information fbr 'FCC does exist within the range of' parameters selected under investigation. The material for specimen has been carefully selected, and does represent the wider range of thermo-physical properties (thermal conductivity, hardness etc.). Thus, the effect of various parameters on l'CC for similar materials in contact will he investigated. | en_US |
dc.description.sponsorship | INDIAN INSTITUTE OF TECHNOLOGY ROORKEE | en_US |
dc.language.iso | en | en_US |
dc.publisher | I I T ROORKEE | en_US |
dc.subject | Electronic Packaging | en_US |
dc.subject | Manufacturing Processes | en_US |
dc.subject | Nuclear Reactor | en_US |
dc.subject | Interstitial Pressure | en_US |
dc.title | A BENCHMARK DATA SET FOR THERMAL CONTACT CONDUCTANCE AT THE INTERFACE BETWEEN DIFFERENT ENGINEERING MATERIALS | en_US |
dc.type | Other | en_US |
Appears in Collections: | MASTERS' THESES (MIED) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
G24050.pdf | 9.08 MB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.