PULSED POTENTIAL ELECTRODEPOSITION OF POROUS COPPER

Abstract

This work aims to study the morphology of porous copper deposits using hydrogen bubble dynamic template. Electrolyte with composition of 0.12M CuSO4 and 0.4M H2SO4 was used for square pulse potential electrodeposition at different frequencies and duty cycle. Mean potential of -0.78V and amplitude 100mV was used to form porous foam structure of copper deposits. After electrodeposition, electrochemical impedance spectroscopy was performed in 2.5M NaCl solution at room temperature for the determination of electrochemically active true surface area. Morphology of the copper deposits was analyzed using scanning electron microscope. It was found that except at 15% duty cycle at all frequencies dendritic structure of copper was formed with porosity in between due to hydrogen evolution. EIS data was analysed for electrochemically active true surface area and porous structure at 10Hz and 20Hz frequency and 15% duty cycle gave maximum value of electrochemically active true surface area with maximum true capacitance.