NUMERICAL STUDY OF FREE CONVECTION IN PARALLEL PLATE VERTICAL CHANNEL WITH INTERNAL OBSTRUCTION

Abstract

The failure of micro electronic components i.e. chips which are mounted on printed circuit board increases exponentially as the junction temperature increases. It is important in the packaging of these printed circuit boards to predict the heat transfer characteristics for all anticipated modes of heat transfer. There are two method of cooling i.e. forced convection and natural convection. Natural convection is an important mode of heat transfer for both air and liquid because it is ease, reliable and cheap. Natural convention cooling in vertical channel_ containing printed circuit boards as obstructions is, commonly used in electronic system because it is very cheap and size of system is not affected. A numerical study of free convection in parallel plate vertical channel with internal obstructions is presented. A finite difference method is used to solve the equations. The steady state formulationsincluding axial diffusion in momentum are used. Results have been obtained for velocity, temperature and Nusselt number for various Grash6fL numbers, Prandt) numbers, obstruction lengths and heights at which plate is fixed. By using these values, a correlation between above parameter is also developed which may be used for, actual design of-'such free convective cooling system