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DC Field | Value | Language |
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dc.contributor.author | Arora, Sudha | - |
dc.date.accessioned | 2014-11-23T09:18:24Z | - |
dc.date.available | 2014-11-23T09:18:24Z | - |
dc.date.issued | 1991 | - |
dc.identifier | M.Tech | en_US |
dc.identifier.uri | http://hdl.handle.net/123456789/10261 | - |
dc.guide | Gupta, H. O. | - |
dc.description.abstract | The complexity of the electronic circuits is increasing with the rapid development of electronics. The main attribute for the full utilisation of the development is reliability of the components. Therefore reliability evaluation is necessary before circuit design such that the area of •high failure rate concentration in the complex circuits is known. To evaluate the failure rate of components with database structure, part stress analysis is most suitable. The electrical and thermal stresses for each component is obtained from circuit analysis. Package for circuit analysis program for d.c. and transient analysis is adopted and checked on two examples. This furnishes the data of current and voltage transients and their rate of change which is important from reliability point of view. The component failure rates in a data base structure for reliabijity evaluation are stored in dBASE III plus package. | en_US |
dc.language.iso | en | en_US |
dc.subject | ELECTRICAL ENGINEERING | en_US |
dc.subject | ELECTRONIC CIRCUIT | en_US |
dc.subject | PART STRESS ANALYSIS METHOD | en_US |
dc.subject | THERMAL STRESSES | en_US |
dc.title | RELIABILITY EVALUATION OF ELECTRONIC CIRCUIT USING PART STRESS ANALYSIS METHOD | en_US |
dc.type | M.Tech Dessertation | en_US |
dc.accession.number | 246222 | en_US |
Appears in Collections: | MASTERS' THESES (Electrical Engg) |
Files in This Item:
File | Description | Size | Format | |
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ECD246222.pdf | 2.65 MB | Adobe PDF | View/Open |
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