Please use this identifier to cite or link to this item: http://localhost:8081/xmlui/handle/123456789/10261
Title: RELIABILITY EVALUATION OF ELECTRONIC CIRCUIT USING PART STRESS ANALYSIS METHOD
Authors: Arora, Sudha
Keywords: ELECTRICAL ENGINEERING;ELECTRONIC CIRCUIT;PART STRESS ANALYSIS METHOD;THERMAL STRESSES
Issue Date: 1991
Abstract: The complexity of the electronic circuits is increasing with the rapid development of electronics. The main attribute for the full utilisation of the development is reliability of the components. Therefore reliability evaluation is necessary before circuit design such that the area of •high failure rate concentration in the complex circuits is known. To evaluate the failure rate of components with database structure, part stress analysis is most suitable. The electrical and thermal stresses for each component is obtained from circuit analysis. Package for circuit analysis program for d.c. and transient analysis is adopted and checked on two examples. This furnishes the data of current and voltage transients and their rate of change which is important from reliability point of view. The component failure rates in a data base structure for reliabijity evaluation are stored in dBASE III plus package.
URI: http://hdl.handle.net/123456789/10261
Other Identifiers: M.Tech
Research Supervisor/ Guide: Gupta, H. O.
metadata.dc.type: M.Tech Dessertation
Appears in Collections:MASTERS' THESES (Electrical Engg)

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