Please use this identifier to cite or link to this item: http://localhost:8081/xmlui/handle/123456789/10053
Title: DEV. OF LABORATORY SCALE CONTINUOUS ELECTROPLATING BATH FOR COPPER PLATING
Authors: Datt, Vishnu
Keywords: COPPER PLATING;ELECTROPLATING;LABORATORY SCALE;METALLURGICAL AND MATERIALS ENGINEERING
Issue Date: 1995
Abstract: Electroplating of metals process is a useful process in commercial field like Galvanising process, Plating of layers of different metals of different thickness on toys. The development of a bath for the electroplating is an important consideration. This electroplating may be continuous process or not. But continuous electroplating is a most economical process for plating the metals on other metals. Copper metal is most common for plating on other metals or steels. The desired coating is done by means of electrolysis. Its purpose is to alter the characteristic of a surface so as to provide improved appearance, ability to withstand corrosive agents, resistance to abrasion, or other desired properties. In copper plating we are concerned primarily with dissolving copper from the anode and decomposition of copper at the cathode. The electroplating of copper on a steel plate is required to some thickness (layer
URI: http://hdl.handle.net/123456789/10053
Other Identifiers: M.Tech
Research Supervisor/ Guide: Misra, P. S
Kapoor, M. L.
metadata.dc.type: M.Tech Dessertation
Appears in Collections:MASTERS' THESES (MMD)

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